Intra-capsular pinhole shrinkage (pore shrinkage)
Elaborated ultra thin film
Available for new technology
Secure HVSFS equipment
With all the many advantages of thermal spray, there exit one problem, the existence of pinholes in the coating layer. This problem can be solved using Nano powder. The problem with using nano powders also is its low melting rate as a result of cohesion due to increased surface area
Thermal spray is possible by transferring the powder from the feeder to the Torch (Gun)
For this, a stable suspension of the nano powder is made and transported to the torch to reduce aggregation due to cohesion
Application